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INPHOTEC will participate to EMPC2019 in Pisa

INPHOTEC will participate from 16-19 September at EMPC2019 conference

EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi,

INPHOTEC will be present with a booth at the R&D Village, introducing the packaging line and some recent technological results.

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